Method of preparing portions of a semiconductor wafer surface fo

Details Method of preparing portions of a semiconductor wafer surface fo Method of preparing portions of a semiconductor wafer surface fo

1975-04-14

1977-07-12

Pavelko, Thomas P.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

148 15, 148187, 156659, 264102, 264139, 264293, 264310, 264340, 427 85, 427264, B29C 1708

Patent

active

040352269

ABSTRACT:
A method for producing a pattern on a semiconductor wafer during the fabrication of semiconductor devices, including integrated circuits is disclosed. A master is pressed into a layer of moldable material which is on the wafer surface to define a pattern of at least one relatively thin region and relatively thick regions therein with a high degree of definition. Thereafter the whole layer is treated, for example, to remove, by etching for example, a relatively thin region to expose a portion of the wafer surface, the relatively thick regions remaining on the wafer surface.

REFERENCES:
patent: 3048512 (1962-08-01), Nelson
patent: 3165430 (1965-01-01), Hugle
patent: 3240624 (1966-03-01), Beck
patent: 3538571 (1970-11-01), Callahan et al.
patent: 3542551 (1970-11-01), Rice
patent: 3544287 (1970-12-01), Sharp
patent: 3649393 (1972-03-01), Hatzakis
patent: 3923566 (1975-12-01), Lawson

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