Method of preparing an electronic package by co-curing adhesive

Details Method of preparing an electronic package by co-curing adhesive Method of preparing an electronic package by co-curing adhesive

1998-07-14

1999-10-26

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438127, 438119, 438 15, H01L 2144, H01L 2148, H01L 2150, G01R 3126

Patent

active

059727357

ABSTRACT:
A semi-conductor package in which an integrated circuit chip is connected to a substrate using wire-bonding is prepared by curing the die attach adhesive and encapsulating the wire bonds in one heating step. The encapsulant composition has a curing chemistry and a curing profile compatible with those of the adhesive.

REFERENCES:
patent: 5837558 (1998-11-01), Zuniga et al.

Affiliated with

Also associated with

Rating

Method of preparing an electronic package by co-curing adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of preparing an electronic package by co-curing adhesive , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of preparing an electronic package by co-curing adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-763353