Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
Inventor
active
Adhesive wafers for die attach application
Method of preparing an electronic package by co-curing adhesive
No associations
LandOfFree
Christopher J. Dominic does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Christopher J. Dominic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Christopher J. Dominic will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-974467