Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1996-06-12
1999-07-13
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430394, G03F 700
Patent
active
059225173
ABSTRACT:
Bridging between electrically conductive circuit features during conformal plating is prevented by avoiding the deposition of catalytic seed material onto non-circuit areas of the substrate. Preparatory to forming electrical circuit features on a nonconductive substrate by the full additive process, extraneous seed material is either trapped between two layers of a photoimageable film, whereby it is unavailable during plating, or deposited on the surface of an aqueous photoimageable film, which is removed prior to plating. The method embodying the present invention eliminates the need for seed removal after initial plating and prior to conformal plating of a precious metal over the initial plating.
REFERENCES:
patent: 4554182 (1985-11-01), Bupp et al.
patent: 5112726 (1992-05-01), Cohen et al.
patent: 5260170 (1993-11-01), Brown
patent: 5318803 (1994-06-01), Bickford et al.
patent: 5320934 (1994-06-01), Misium et al.
Bhatt Anilkumar Chinuprasad
Bhatt Ashwinkumar C.
Jones Gerald Walter
Markovich Voya Rista
Wilson William Earl
Duda Kathleen
Hogg William N.
International Business Machines - Corporation
LandOfFree
Method of preparing a substrate surface for conformal plating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of preparing a substrate surface for conformal plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of preparing a substrate surface for conformal plating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2274820