Method of post-etching a mechanically treated substrate

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask is multilayer resist

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216 44, 216 52, B44C 122

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active

060457155

ABSTRACT:
Method of providing a pattern of apertures and/or cavities in, for example, a glass duct plate of a plasma-addressed liquid crystal display, in which first a mechanical treatment is performed (for example, by means of powder blasting) and then a wet-chemical etching treatment is performed to render the walls of the ducts microscopically less rough so that the optical disturbance is reduced and the glass becomes clearer again.

REFERENCES:
patent: 3276927 (1966-10-01), Medford
patent: 3693302 (1972-09-01), Hakes
patent: 4106859 (1978-08-01), Doriguzzi et al.
patent: 5347712 (1994-09-01), Yasuda et al.

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