Method of polishing and cleaning substrates

Details Method of polishing and cleaning substrates Method of polishing and cleaning substrates

2005-05-03

2005-05-03

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S041000, C451S054000, C451S059000, C451S067000, C451S339000

Reexamination Certificate

active

06887124

ABSTRACT:
The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station located in a chamber of the module to hold a plurality of substrates in a substantially horizontal position. The storage station may hold pad break-in wafers for pad preconditioning and/or monitor wafers for defects monitoring. The particle monitor may have a port coupled to the factory interface module.

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