Method of polishing a semiconductor wafer

Details Method of polishing a semiconductor wafer Method of polishing a semiconductor wafer

1997-05-30

1999-04-13

Chaudhuri, Olik

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

451285, 451 41, 451283, H01L 21302

Patent

active

058937552

ABSTRACT:
A method of polishing semiconductor wafers is provided. The method will not impair the original (pre-polishing) contour of semiconductor wafers, and semiconductor wafers can be polished so as to have high flatness. In the method according to this invention, a silicon rubber sheet 2 is fixed on a base 4, and an abrasive cloth 5 is secured on the silicon rubber sheet 2. A template 1 of thickness close to that of a semiconductor wafer 10 is secured on a backing pad 32. The semiconductor wafer 10 is restrained by the template 1 and is impelled in to contact with the abrasive cloth 5 to polish effectively.

REFERENCES:
patent: 4910155 (1990-03-01), Cote et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5736427 (1998-04-01), Henderson

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