Method of polishing a semiconductor-on-insulator structure

Details Method of polishing a semiconductor-on-insulator structure Method of polishing a semiconductor-on-insulator structure

2007-12-25

2007-12-25

Tran, Binh X. (Department: 1792)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S692000, C216S084000, C216S085000, C216S089000

Reexamination Certificate

active

11314060

ABSTRACT:
A method of polishing a semiconductor layer formed on a transparent substrate is described, the method including measuring the thickness of the semiconductor from the substrate side of the semiconductor layer simultaneously with the polishing, and using the thickness measurement to modify the polishing.

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