Method of plating and method of manufacturing a micro device

Details Method of plating and method of manufacturing a micro device Method of plating and method of manufacturing a micro device

2007-06-15

2010-12-21

Nguyen, Nam X (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S125000

Reexamination Certificate

active

07854829

ABSTRACT:
A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.

REFERENCES:
patent: 4315985 (1982-02-01), Castellani et al.
patent: 2004/0084777 (2004-05-01), Yamanoue et al.
patent: A-55-085691 (1980-06-01), None
patent: A 02-228493 (1990-09-01), None
patent: A 11-001799 (1999-01-01), None
patent: A-2002-020897 (2002-01-01), None

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