Method of planarizing the surface of a semiconductor device, in

Details Method of planarizing the surface of a semiconductor device, in Method of planarizing the surface of a semiconductor device, in

1986-09-15

1987-09-08

Bashore, S. Leon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156646, 156653, 156657, 156668, H01L 21306, H01L 21318

Patent

active

046922040

ABSTRACT:
A method of planarizing the surface of a semiconductor device comprising a substrate carrying on its surface a contact configuration, which method essentially consists in that the following steps are successively carried out:

REFERENCES:
patent: 4289188 (1981-09-01), Mizutani et al.
patent: 4511430 (1985-04-01), Chen et al.
patent: 4515652 (1985-05-01), Gimpelson et al.
patent: 4545852 (1985-10-01), Barton

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