Method of planarizing semiconductor wafers

Details Method of planarizing semiconductor wafers Method of planarizing semiconductor wafers

1997-07-10

1999-08-10

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

134 2, 216 38, 438745, H01L 2100

Patent

active

059358696

ABSTRACT:
A CMP semiconductor wafer planarization method is provided employing an aqueous solution of a trialkanol amine as a wafer cleaning solution. Wafers are produced exhibiting a substantial reduction in semiconductor device failures as shown by a significant decrease in m.sub.1- m.sub.1 (metal to metal) shorts.

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Post-Tungsten CMP Cleaning: Issues and Solutions; Cleaning/Stripping;Fury and Krusell; Oct. 1995.
IBM Technical Disclosure Bulleting; Post Chemical Mechanical Polishing Cleaning of Semiconductor Wafer; vol. 38, No. 03, Mar. 1995.

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