Method of placing wires

Details Method of placing wires Method of placing wires

2011-01-25

2011-01-25

Chiang, Jack (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

07877709

ABSTRACT:
A method of placing wires for placing a shield wire with respect to a shield subject wire placed on a chip, a method includes setting a plurality of wire tracks on the chip, dividing the chip into at least a first area and a second area according to a division boundary, confirming whether the shield subject wire exists around the division boundary in the second area when the division boundary is not laid on top of the wire track, and determining whether to place the shield wire on a wire track being adjacent to division boundary in the first area based on the confirming.

REFERENCES:
patent: 6951007 (2005-09-01), Kaida
patent: 2004/0031010 (2004-02-01), Kaida
patent: 2006/0190902 (2006-08-01), Shirai
patent: 2974398 (1999-09-01), None

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