Method of placing an oriented array of devices on a releasable m

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156632, 156633, 156659, H01L 750

Patent

active

040239977

ABSTRACT:
An oriented array of small, fragile electrical devices such as beam lead transistors or integrated circuits, partially embedded in wax, are removed from the wax and transferred to a releasable mounting without disrupting the orientation of the devices. The releasable mounting comprises a plate with a layer of silicone rubber or resin which exerts a suction or vacuum holding force on the array of oriented devices.

REFERENCES:
patent: 2958120 (1960-11-01), Taylor
patent: 2988839 (1961-06-01), Greenman et al.
patent: 3152939 (1964-10-01), Borneman et al.

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