Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2005-08-22
2008-10-28
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S014000, C438S016000
Reexamination Certificate
active
07442561
ABSTRACT:
A method of piping defect detection is provided. A semiconductor substrate having an active region and an isolation region is provided, a plurality of semiconductor elements are formed on the semiconductor substrate, a dielectric layer is deposited on the semiconductor substrate and the semiconductor elements, and first and second contact plugs are formed in the dielectric layer to connect the active region and the isolation region respectively. The first contact plug and the second contact plug are illuminated by an electron beam, accumulating charge on the second contact plug, and piping defects are detected between the first contact plug and the second contact plug according to brightness contrast between the first contact plug and the second contact plug.
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Chi Ju-Hsin
Lin Yu-Chi
Lin Yung-Chih
Wu Kun-Jung
Yu Pin-Yuan
Menz Laura M
Muncy Geissler Olds & Lowe, PLLC
Powerchip Semiconductor Corp.
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