Method of photolithographically producing a copper pattern on a

Details Method of photolithographically producing a copper pattern on a Method of photolithographically producing a copper pattern on a

1996-02-07

1998-04-14

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430318, 427 58, 427123, G03F 700

Patent

active

057389772

ABSTRACT:
A method of forming copper patterns on a selection plate for a display, the selection plate having a plurality of holes. The method provides copper patterns that form selected tracks on the selection plate and that are disposed internally of selected holes, the copper patterns being sealed with a corrosion-resistant layer of nickel-phosphorous. The method includes steps of forming a copper layer on at least one surface of the selection plate, forming a layer of nickel-boron on the copper layer, using cataphoretic lithographic processing to form the desired patterns, and providing a nickel-phosphorous layer to seal the patterns.

REFERENCES:
patent: 3240684 (1966-03-01), Martin
patent: 4814205 (1989-03-01), Arcilesi et al.
patent: 5235139 (1993-08-01), Bengston
patent: 5474798 (1995-12-01), Larson

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