Method of performing rework test on integrated circuit packages

Details Method of performing rework test on integrated circuit packages Method of performing rework test on integrated circuit packages

1999-04-05

2000-12-12

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438616, 257778, 257737, H01L 21288

Patent

active

061598380

ABSTRACT:
A method for performing rework test on integrated circuit (IC) packages is provided. By this method, the first step is to remove a selected part of the casing of the IC package to form an opening in the casing to expose the IC chip contained in the casing. Then, an adhesive layer, such as a double adhesive tape, is attached over the casing on the side where the opening is formed. Then, a heat-insulative cover, such as a ceramic cover, is adhered to the double adhesive tape. After this, the entire IC package is mounted by solder on a test circuit board, allowing a function test procedure to be performed on the internal circuitry of the IC chip contained in the casing. During the function test procedure, when necessary, the ceramic cover can be easily and effortlessly detached to allow the test engineer to visually inspect the inside IC chip for any structural problems.

REFERENCES:
patent: 5125509 (1992-06-01), Takei et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5258575 (1993-11-01), Beppu et al.
patent: 5376588 (1994-12-01), Pendse
patent: 5675179 (1997-10-01), Shu et al.
patent: 5702224 (1997-12-01), Kubota
patent: 5836454 (1998-11-01), Evers
patent: 5872051 (1999-02-01), Fallon et al.
patent: 5925934 (1999-07-01), Lim
patent: 5996805 (1999-12-01), Evers

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