Method of performing plain etching treatment and apparatus there

Details Method of performing plain etching treatment and apparatus there Method of performing plain etching treatment and apparatus there

1993-01-14

1995-05-16

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, H10L 2100

Patent

active

054157285

ABSTRACT:
Disclosed herein are a dry etching method and a dry etching apparatus. The method comprises a step of applying an etching inhibiting gas to that portion of a workpiece where etching speed is high, while the workpiece is being etched with reactive-gas plasma. The apparatus comprises functions for holding a reactive etching gas, a first electrode located within the gas-holding functions, for supporting a workpiece, a second electrode located within the gas-holding functions and spaced apart from the first electrode by a predetermined distance, functions for supplying high-frequency power, thereby to convert the reactive etching gas into a plasma in the space between the first and second electrodes, and functions for supplying an etching inhibiting gas to that portion of the workpiece where etching speed is high.

REFERENCES:
patent: 4427515 (1984-01-01), Yuhara et al.
patent: 5084126 (1992-01-01), McKee
patent: 5105761 (1992-04-01), Charlet et al.

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