Method of peeling photo-resist layer without damage to metal wir

Details Method of peeling photo-resist layer without damage to metal wir Method of peeling photo-resist layer without damage to metal wir

1997-02-06

1998-06-02

Baxter, Janet C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Removal of imaged layers

430256, 430325, 430331, G03C 500

Patent

active

057597510

ABSTRACT:
A semiconductor manufacturer peels a photo-resist mask off by using organic alkaline solvent, and the residual alkaline solvent is neutralized with acid before a rinse in pure water so as to prevent a metal wiring from erosion due to strong alkaline solution produced from the residual organic alkaline solvent.

REFERENCES:
patent: 4714517 (1987-12-01), Malladi et al.
patent: 5308745 (1994-05-01), Schwartzkopf
patent: 5578193 (1996-11-01), Aoki et al.
Inorganic Chemistry, 2nd ed., J.E. Huheey, Haper & Row, NY, 1978, pp. 258-259.

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