Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1976-11-01
1977-07-12
Van Horn, Charles E.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29578, 156649, 156656, 204192E, 427 89, 427 98, H01L 2188
Patent
active
040352080
ABSTRACT:
The disclosure relates to patterning of platinum effectively and then removing the mask from the platinum without attacking the chromium metal beneath the platinum. If tantalum is used on top, which metal can be patterned with CF.sub.4, the tantalum can be patterned and the platinum can then be patterned quite readily and the tantalum can then be removed with the CF.sub.4 again and then the gold can be plated up onto the platinum patterns and the chromium can then be etched out using conventional chromium etch which will not attack any of the other metals.
This solves the problem of high yield patterning with a metal mask and process for patterning and removal of that metal mask that is compatible with the chromium-platinum metal system. The advantage of the chromium-platinum system over the titanium-platinum system is the resistance of the chromium to silicon etch. Therefore, the principal application of this invention would be in the fabrication of mesa devices.
REFERENCES:
patent: 3386894 (1968-06-01), Steppat
patent: 3642548 (1972-02-01), Eger
patent: 3657029 (1972-04-01), Fuller
patent: 3795557 (1974-03-01), Jacob
patent: 3900944 (1975-08-01), Fuller et al.
patent: 3951709 (1976-04-01), Jacob
Battershall Barry William
Fuller Clyde Rhea
Comfort James T.
Honeycutt Gary C.
Levine Harold
Massie Jerome W.
Texas Instruments Incorporated
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