Method of patterning a reflective surface in an integrated circu

Details Method of patterning a reflective surface in an integrated circu Method of patterning a reflective surface in an integrated circu

1992-05-29

1994-05-10

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

436311, 436318, 436319, 436329, 156643, 156660, 1566611, G03C 516, G03F 726

Patent

active

053106229

ABSTRACT:
A method for patterning a reflective surface in an integrated circuit. A first photoresist layer is formed over a conductive layer in the integrated circuit. A second photoresist layer is then formed over the first photoresist layer, where the transmittance of the first photoresist layer is less than the transmittance of the second photoresist layer. The first and second photoresist layers are exposed to define a masking pattern, and portions of the first and second masking layers are then removed to form a mask which corresponds to the masking pattern. Finally, the conductive layer is patterned using the mask formed by the first and second photoresist layers.

REFERENCES:
patent: 4362809 (1982-12-01), Chen
patent: 4770739 (1988-09-01), Orvek
patent: 4906552 (1990-03-01), Ngo
patent: 5091289 (1992-02-01), Cronin

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