Method of patterning a porous dielectric material

Details Method of patterning a porous dielectric material Method of patterning a porous dielectric material

2007-05-22

2007-05-22

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S629000, C438S653000, C257SE21584

Reexamination Certificate

active

11169367

ABSTRACT:
A method of patterning a porous dielectric material that includes an ash process to treat the porous dielectric material. The treated porous dielectric material allows for the formation of a substantially continuous barrier layer, which can inhibit diffusion of, for example, a conductive material into to the dielectric material. Other embodiments are described and claimed.

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