Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Passivating of surface
Reexamination Certificate
2006-05-16
2006-05-16
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Passivating of surface
C438S154000, C438S199000, C438S958000
Reexamination Certificate
active
07045376
ABSTRACT:
A method of passivating a semiconductor device with two types of transistors, e.g., NMOS and PMOS transistors, the semiconductor device is placed in a pressurized sealed chamber and at least two different passivating gases are introduced into the chamber. The two passivating gases can be selected to have one gas suitable for passivating PMOS transistors and the other gas suitable for NMOS transistors.
REFERENCES:
patent: 5545289 (1996-08-01), Chen et al.
patent: 6274490 (2001-08-01), Chyan et al.
patent: 6670289 (2003-12-01), Lane et al.
patent: 6723665 (2004-04-01), Tanabe et al.
patent: 2002/0020840 (2002-02-01), Nakajima
patent: 2004/0058560 (2004-03-01), Ranish et al.
S. Wolf and R.N. Tauber, Silicon Processing for the VLSI Era, vol. 1, Lattice Press, 1986, p. 145.
Chang Shih Chang
Deng De Hua
Tsai Yaw Ming
Wang Shih Pin
Doty Heather
Jr. Carl Whitehead
Toppoly Optoelectronics Corp.
LandOfFree
Method of passivating semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of passivating semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of passivating semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3585218