Method of partial depth material removal for fabrication of...

Etching a substrate: processes – Forming or treating article containing magnetically...

Reexamination Certificate

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Details

C216S027000, C216S066000, C360S322000, C360S319000, C360S324200

Reexamination Certificate

active

07419610

ABSTRACT:
A method for fabricating a read head sensor for a magnetic disk drive is presented. The method includes providing a layered wafer stack to be shaped, where the layered wafer stack includes a free layer, a barrier layer and a pinned layer. A single- or multi-layered photoresist mask is formed upon the layered wafer stack to be shaped. A material removal source is provided and used to perform a partial depth material removal within a partial depth material removal range which extends from the free layer to within the pinned layer to a partial depth material removal endpoint. In various embodiments, this depth endpoint lies at or within the barrier layer or within but not through the pinned layer.

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