Method of packaging semiconductor die without lead frame or...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

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C257S778000, C257SE23116

Reexamination Certificate

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07432130

ABSTRACT:
A method of packaging a semiconductor die (10) includes providing a flip-chip die (10) with bump connections (12) on its bottom surface (14). An adhesive tape (18) is attached to a plate surface (16) and lead fingers (20) are formed on the tape (18). The die (10) is placed on the tape (18) such that the bumps (12) on the die (10) contact respective ones of the lead fingers (20) on the tape (18). A reflow process is performed on the die (10), the tape (18) and the plate (16), which forms C5 type interconnects. A mold compound (24) is formed over the die (10) and the tape (18), and then the tape (18) and the plate (16) are removed.

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patent: 6507120 (2003-01-01), Lo et al.
patent: 6818976 (2004-11-01), Kang et al.
patent: 2002/0079592 (2002-06-01), Lo et al.
patent: 2005/0006787 (2005-01-01), Chiu
patent: 2005/0104226 (2005-05-01), Chang et al.
patent: 2005/0284918 (2005-12-01), Martin et al.
patent: 2006/0234421 (2006-10-01), Lo et al.
patent: 2007/0063331 (2007-03-01), Kwon et al.

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