Method of packaging and interconnection of integrated circuits

Details Method of packaging and interconnection of integrated circuits Method of packaging and interconnection of integrated circuits

2011-06-21

2011-06-21

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S779000, C257S780000, C257SE23021, C257SE23023

Reexamination Certificate

active

07964964

ABSTRACT:
A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low temperature amalgam curing, the chip and the substrate form a flexible substrate IC packaging with high conductivity, controllable interface layer thickness, micron-scale contact density and low process temperature. Adhesion between the chip and the substrate can be further enhanced by coating other areas with non-conducting adhesive.

REFERENCES:
patent: 5053195 (1991-10-01), McKay
patent: 5196726 (1993-03-01), Nishiguchi et al.
patent: 5225157 (1993-07-01), McKay
patent: 5406025 (1995-04-01), Carlstedt
patent: 5672913 (1997-09-01), Baldwin et al.
patent: 5956235 (1999-09-01), Kresge et al.
patent: 6008542 (1999-12-01), Takamori
patent: 6042391 (2000-03-01), Bodo et al.
patent: 6114221 (2000-09-01), Tonti et al.
patent: 6323058 (2001-11-01), Murakamz et al.
patent: 6410415 (2002-06-01), Estes et al.
patent: 6495441 (2002-12-01), Kitajima et al.
patent: 6554923 (2003-04-01), Bhattacharya et al.
patent: 2002/0050652 (2002-05-01), Akram et al.
patent: 2002/0142575 (2002-10-01), Lee

Affiliated with

Also associated with

Rating

Method of packaging and interconnection of integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of packaging and interconnection of integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of packaging and interconnection of integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2664380