Method of optimizing seasoning recipe for etch process

Details Method of optimizing seasoning recipe for etch process Method of optimizing seasoning recipe for etch process

2006-10-10

2006-10-10

Chen, Kin-Chan (Department: 1765)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C216S060000

Reexamination Certificate

active

07118926

ABSTRACT:
A method for optimizing a seasoning recipe for a dry etch process. The method includes setting a critical value of reproducibility, a main etch recipe, and a preliminary seasoning recipe. A test wafer is then etched using the preliminary seasoning recipe in a dry etch chamber. Next, a main etch process is performed with respect to at least 10 run wafers in the dry etch chamber using the main etch recipe and an end-point detection time for each wafer is determined. An initial dispersion and a standard deviation are then determined using the determined end-point detection times. The critical value of reproducibility is then compared to the initial dispersion. If the initial dispersion is equal to or less than the critical value of reproducibility, the preliminary seasoning recipe is used as the seasoning recipe, otherwise the preliminary seasoning recipe is modified and the process is repeated until an optimal seasoning recipe is determined.

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