Method of mounting silicon wafers on metallic mounting surfaces

Details Method of mounting silicon wafers on metallic mounting surfaces Method of mounting silicon wafers on metallic mounting surfaces

1992-02-24

1993-06-01

Heinrich, Samuel M.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 228175, 228189, B23K 3102

Patent

active

052152448

ABSTRACT:
A method of mounting a semiconductor wafer (10) on a metallic mounting surface, particularly during manufacture of valves with macromechanical valve bodies (20), features the steps of applying a metallization (11) to at least one major surface of the semiconductor wafer, and thereafter soldering the thus-metallized major surface, either wholly or in localized surface areas, to the metallic mounting surface.

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Taylor Lyman, "Metals Handbook", 1948 Edition, p. 604.

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