Method of mounting semiconductor chip to circuit substrate...

Details Method of mounting semiconductor chip to circuit substrate... Method of mounting semiconductor chip to circuit substrate...

2008-01-17

2010-12-21

Chu, Chris (Department: 2815)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S108000, C438S612000, C257SE23179, C257S737000, C257S780000, C257S797000

Reexamination Certificate

active

07855136

ABSTRACT:
A semiconductor chip comprises a silicon substrate on which semiconductor elements are formed, pads, each of which is formed on the silicon substrate and electrically connected to at least one of the semiconductor elements, a first insulating layer having an opening over each one of the pads, a first wiring layer formed on the first insulating layer, electrically connected to the pads and having connecting parts, a second insulating layer formed on the first wiring layer and having openings over the connecting parts of the first wiring layer, electrically functioning solder bumps, each of which is formed on one of the openings of the second insulating layer with electrically connecting to one of the pads via the first wiring layer, and dummy bumps for self adjustment, each of which is formed on one of the openings of the second insulating layer without electrically connecting to the pad.

REFERENCES:
patent: 4764804 (1988-08-01), Sahara et al.
patent: 5289038 (1994-02-01), Amano
patent: 5554887 (1996-09-01), Sawai et al.
patent: 5726502 (1998-03-01), Beddingfield
patent: 6489678 (2002-12-01), Joshi
patent: 6512298 (2003-01-01), Sahara et al.
patent: 6841873 (2005-01-01), Yoshida et al.
patent: 6929979 (2005-08-01), Andoh
patent: 7052933 (2006-05-01), Weekamp et al.
patent: 7126227 (2006-10-01), Yamaguchi
patent: 7352063 (2008-04-01), Noguchi
patent: 7728430 (2010-06-01), Yamaguchi
patent: 2006/0055028 (2006-03-01), Hasunuma
patent: 6-132353 (1994-05-01), None
patent: 9-260429 (1997-10-01), None
patent: 2003-017530 (2003-01-01), None

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