Method of mounting memory device on PCB for memory module

Details Method of mounting memory device on PCB for memory module Method of mounting memory device on PCB for memory module

2008-03-25

2008-03-25

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257SE21499, C361S760000, C361S777000

Reexamination Certificate

active

07348219

ABSTRACT:
A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board (PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.

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