Method of mounting integrated circuit interconnect leads releasa

Details Method of mounting integrated circuit interconnect leads releasa Method of mounting integrated circuit interconnect leads releasa

1987-03-19

1991-10-15

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437217, 437212, 29827, H01L 2106

Patent

active

050574612

ABSTRACT:
A method and film/interconnect lead combination for attaching a plurality of sets of interconnect leads on a strip of film using an adhesive which loses bonding strength upon being exposed to energy such as heat or ultra violet light. The film holds the interconnect leads firmly in their proper position for bonding to an integrated circuit chip and to a leadframe or substrate such as a printed wiring board or a ceramic substrate for hybrid circuits. Either during or after bonding the interconnect leads to the leadframe or substrate, energy is applied to the adhesive holding the interconnect leads to the film and the film is detached from the interconnect leads in a manner which will not damage the leads due to the reduced adhesive strength. Thus, the leadframe package will not enclose the film.

REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3785895 (1974-01-01), Ettre et al.
patent: 4100675 (1978-07-01), Landsittel
patent: 4697885 (1987-10-01), Minowa et al.

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