Method of mounting electronic components and apparatus therefor

Details Method of mounting electronic components and apparatus therefor Method of mounting electronic components and apparatus therefor

2005-08-30

2005-08-30

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S739000, C029S740000, C029S741000, C029S825000, C029S833000

Reexamination Certificate

active

06935019

ABSTRACT:
For implementing a method of mounting electronic components, and an apparatus therefor, which has a much reduced tact time, the nozzles3a,3b,3c,3d,3eand3fare kept in holes5provided in a straight line row in nozzle stocker4in the order of use sequence. When the type of electronic components to be mounted on a circuit board changes, transfer head1has to go to a place above the nozzle stocker4to replace the nozzle. In the invented mounting method, and mounting apparatus, the transfer head1is required to move only to a place above the next nozzle3bafter returning the used nozzle3ato a hole5. Thus the stroke L of transfer head1needed for the nozzle exchange is significantly reduced, and the nozzle may be replaced within a short time.

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