Method of mounting an integrated circuit on a printed circuit bo

Details Method of mounting an integrated circuit on a printed circuit bo Method of mounting an integrated circuit on a printed circuit bo

1997-11-26

2000-04-11

Jeffery, John A.

Electric resistance heating devices

Heating devices

Radiant heater

219 8512, 219 8513, 228 33, 2281801, 228223, B23K 3100

Patent

active

060496568

ABSTRACT:
A method of mounting an integrated circuit having a plurality of leads on a printed circuit board (PCB), by: removing foreign substances on the PCB; spreading a flux on lead patterns formed on the PCB; aligning the leads of the integrated circuit on the lead patterns on the PCB on which the flux is spread; soldering the leads and lead patterns by covering the part of a semiconductor chip of the aligned integrated circuit using a holding block and radiating an optical beam onto the whole surface thereof; and cooling the holding block and PCB which has been soldered, which prevents shorts and a poor contact generated by an earlier method. As the quality of soldering is enhanced and the lead is not pressured when soldering, the confidence of the integrated circuit after mounting is also enhanced. Moreover, by soldering all of the leads at one time, the operational time can be reduced.

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