Method of mounting an electronic part

Details Method of mounting an electronic part Method of mounting an electronic part

2006-09-05

2006-09-05

Vo, Peter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S843000, C228S180220, C228S205000, C228S219000, C228S221000

Reexamination Certificate

active

07100279

ABSTRACT:
A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.

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