Method of monitoring status of a silicon layer by detecting, emi

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156345, 156643, 156646, 156662, 204192E, 356425, 356437, H01L 21306, C03C 1500, C03C 2506, B44C 122

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active

044301510

ABSTRACT:
In a monitoring method of monitoring status of a silicon layer etched in a hollow space by plasma, a chlorine including gas is introduced into a hollow space to cause CCl-radical to occur in the hollow space. A first spectrum region is selected to detect first emission spectra of the CCl-radical which are variable in intensity only during the etching and which may include a wavelength of 307 nm. Preferably, a second spectrum region is selected to second emission spectra invariable even during the etching and to indicate the beginning and the end of the etching by monitoring a relationship between the first and the second emission spectra. The second spectrum region may include a wavelength of 396 nm. Alternatively, emission spectra of OH-radical which results from water remaining in the hollow space may be monitored as the first emission spectra.

REFERENCES:
patent: 4289188 (1981-09-01), Mizutani et al.
patent: 4367044 (1983-01-01), Booth et al.

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