Method of molding resin to seal electronic parts using two evacu

Details Method of molding resin to seal electronic parts using two evacu Method of molding resin to seal electronic parts using two evacu

1994-04-18

1997-02-18

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Vacuum treatment of work

To degas or prevent gas entrapment

26427214, 26427215, 26427217, 264275, 425546, B29C 4514, B29C 4563

Patent

active

056038798

ABSTRACT:
In a method of molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. According to this method, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.

REFERENCES:
patent: 4599062 (1986-07-01), Konishi
patent: 4793785 (1988-12-01), Osada
patent: 4900485 (1990-02-01), Murakami
patent: 4927590 (1990-05-01), Poelzing
patent: 5059373 (1991-10-01), Hirabayashi
patent: 5082615 (1992-01-01), Sakai
patent: 5204122 (1993-04-01), Konishi
patent: 5366364 (1994-11-01), Tanaka et al.
patent: 5405255 (1995-04-01), Neu
"Analysis of Epoxy Resin by TG/GCMS system (II)"; Shimadzu Application News .

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