Method of molding bonded parts with silicon carbide surfaces

Details Method of molding bonded parts with silicon carbide surfaces Method of molding bonded parts with silicon carbide surfaces

1984-03-29

1985-07-02

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156 89, 1562728, 156643, 156657, 252 792, 252 793, 252 795, 264 56, B44C 122, C03C 1500, C03C 2506, C03B 2900

Patent

active

045266492

ABSTRACT:
For joining molded parts having silicon carbide surfaces, the surfaces are first roughened to a depth of about 100-500 .mu.m by removal of the free silicon either by vaporization or by etching when treating silicon containing silicon carbide layers containing at least 15% weight of excessive silicon. In the alternative, when no excessive silicon is present, the roughening can be done by laser shots pitting the surface. The pores provided by such a step are then loaded with carbon by (repeated) application of a cokable resin followed by coking, said resin can be soaked into the pores or attached as silicon containing resin wafer of cokable material. The surfaces to be joined are united and are heated, preferably at from 1600.degree. to 1800.degree. C. in the presence of silicon that is either made available at the edges of the joint as a liquid or else has been provided in the joint by a synthetic resin foil in which silicon powder is dispersed.

REFERENCES:
patent: 2319323 (1943-05-01), Heyroth
patent: 2943008 (1960-06-01), Saunders
patent: 3857744 (1974-12-01), Moss
patent: 4487644 (1984-12-01), Gupta et al.

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