Metal working – Method of mechanical manufacture – Electrical device making
Patent
1994-06-14
1998-11-10
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
2940201, 2940209, 228 563, 427 96, H05K 300
Patent
active
058325956
ABSTRACT:
A method of modifying an electronic circuit board by performing disconnection or connection of conductive lines at a specified or an arbitrary position of the conductive lines of the electronic circuit board thereby changing an electric circuit and of completely modifying an open pattern defect of the conductive lines or an insulator layer, and its device, wherein a first energy beam is irradiated to portions of repair terminals 9 and 9' which are intended to connect or disconnect, of conductive lines 5 and 5' in the electronic circuit board thereby removing a protection layer, making windows and exposing the terminals 9 and 9' for connection; a second energy beam is irradiated thereby disconnecting the repair terminals 9 and 9', or a metal piece for connecting is supplied to between the repair terminals 9 and 9' and applying an energy thereto thereby electrically connecting them; and the disconnected or connected windowed portion is locally coated with the insulator layer thereby modifying the conductive lines of the electronic circuit board.
Further, windows 311 or 311' is formed in an insulating protection layer 310 on a conductive line connecting portion 308 formed in a couple or a conductive line disconnecting portion 309, a conductive line of the conductive line disconnecting portion is disconnected or a liquid material 312 for connecting conductive lines is supplied to the conductive line connecting portion 308, a metal layer 313 is precipitated by heating the liquid material 312 thereby connecting the conductive line connecting portion 308, and the window 311 or 311' is coated with an organic insulator layer.
REFERENCES:
patent: 4630355 (1986-12-01), Johnson
patent: 4683652 (1987-08-01), Hatfield
patent: 5063660 (1991-11-01), Fiedelius
patent: 5289632 (1994-03-01), Chalco et al.
patent: 5384953 (1995-01-01), Economikos et al
IBM Tech Disclosure Bull. vol. 9 No. 4, Sep. 1966 p. 370, by H. E. Luhn.
S.K. Ray et al, "Engineering Change (EC) Technology for Thin Film Metallurgy on Polyimide Films", 40th ECTC Proceedings, pp. 395-400, 1990.
R.F. Miracky, "Selective-Area Laser-Assisted Processing for Microelectronic Multi-Chip Interconnect Applications", Material Research Society Symposium Proceeding, vol. 129, pp. 547-558, 1989.
A. Yabe, "Laser Chemical Processing", International Laser/Application Seminar-Micromachining, pp. 15-33, 1991. (in Japanese).
Fukuda Hiroshi
Hongo Mikio
Katayama Kaoru
Kazui Shinichi
Maruyama Shigenobu
Arbes Carl J.
Hitachi , Ltd.
LandOfFree
Method of modifying conductive lines of an electronic circuit bo does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of modifying conductive lines of an electronic circuit bo, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of modifying conductive lines of an electronic circuit bo will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1504884