Method of modifying an exposed surface of a semiconductor wafer

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

216 88, 451539, 156345LP, H01L 21302

Patent

active

059587946

ABSTRACT:
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:

REFERENCES:
patent: D366365 (1996-01-01), Hoopman
patent: 1910444 (1933-05-01), Nicholson et al.
patent: 2115897 (1938-05-01), Wooddell et al.
patent: 2286208 (1942-06-01), Kirchner
patent: 2485295 (1949-10-01), Larson
patent: 2667435 (1954-01-01), Goepfert et al.
patent: 2755607 (1956-07-01), Haywood
patent: 2888785 (1959-06-01), Kellican et al.
patent: 2952951 (1960-09-01), Simpson
patent: 3041156 (1962-06-01), Rowse et al.
patent: 3188265 (1965-06-01), Charbonneau et al.
patent: 3324608 (1967-06-01), Hoenig
patent: 3594865 (1971-07-01), Erb
patent: 3605349 (1971-09-01), Anthon
patent: 3849949 (1974-11-01), Steinhauser et al.
patent: 3875703 (1975-04-01), Clemente
patent: 3911562 (1975-10-01), Youmans
patent: 3916584 (1975-11-01), Howard et al.
patent: 4138228 (1979-02-01), Hartfelt et al.
patent: 4314827 (1982-02-01), Leitheiser et al.
patent: 4509581 (1985-04-01), McLane et al.
patent: 4563388 (1986-01-01), Bonk et al.
patent: 4623364 (1986-11-01), Cottringer et al.
patent: 4642126 (1987-02-01), Zador et al.
patent: 4644703 (1987-02-01), Kaczmarek et al.
patent: 4652274 (1987-03-01), Boettcher et al.
patent: 4652275 (1987-03-01), Bloecher et al.
patent: 4663890 (1987-05-01), Brandt
patent: 4671851 (1987-06-01), Beyer et al.
patent: 4735632 (1988-04-01), Oxman et al.
patent: 4744802 (1988-05-01), Schwabel
patent: 4749617 (1988-06-01), Canty
patent: 4751138 (1988-06-01), Tumey et al.
patent: 4770671 (1988-09-01), Monroe et al.
patent: 4773920 (1988-09-01), Chasman et al.
patent: 4799939 (1989-01-01), Bloecher et al.
patent: 4879258 (1989-11-01), Fisher
patent: 4881951 (1989-11-01), Wood et al.
patent: 4885332 (1989-12-01), Bilkadi
patent: 4903440 (1990-02-01), Larson et al.
patent: 4906523 (1990-03-01), Bilkadi et al.
patent: 4927432 (1990-05-01), Budinger et al.
patent: 4930266 (1990-06-01), Calhoun et al.
patent: 4933234 (1990-06-01), Kobe et al.
patent: 4944836 (1990-07-01), Beyer et al.
patent: 4959265 (1990-09-01), Wood et al.
patent: 4974373 (1990-12-01), Kawashima et al.
patent: 4997461 (1991-03-01), Markhoff-Matheny et al.
patent: 5009675 (1991-04-01), Kunz et al.
patent: 5011508 (1991-04-01), Wald et al.
patent: 5011513 (1991-04-01), Zador et al.
patent: 5014468 (1991-05-01), Ravipati et al.
patent: 5015266 (1991-05-01), Yamamoto
patent: 5020283 (1991-06-01), Tuttle
patent: 5061294 (1991-10-01), Harmer et al.
patent: 5077870 (1992-01-01), Melbye et al.
patent: 5085671 (1992-02-01), Martin et al.
patent: 5104421 (1992-04-01), Takizawa et al.
patent: 5104929 (1992-04-01), Bilkadi
patent: 5107626 (1992-04-01), Mucci
patent: 5137542 (1992-08-01), Buchanan et al.
patent: 5141790 (1992-08-01), Calhoun et al.
patent: 5152917 (1992-10-01), Pieper et al.
patent: 5174795 (1992-12-01), Wiand
patent: 5177908 (1993-01-01), Tuttle
patent: 5197999 (1993-03-01), Thomas
patent: 5199227 (1993-04-01), Ohishi
patent: 5203884 (1993-04-01), Buchanan et al.
patent: 5213591 (1993-05-01), Celikkaya et al.
patent: 5219462 (1993-06-01), Bruxvoort et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5236472 (1993-08-01), Kirk et al.
patent: 5254194 (1993-10-01), Ott et al.
patent: 5256170 (1993-10-01), Harmer et al.
patent: 5304223 (1994-04-01), Pieper et al.
patent: 5307593 (1994-05-01), Lucker et al.
patent: 5320706 (1994-06-01), Blackwell
patent: 5335453 (1994-08-01), Baldy et al.
patent: 5342419 (1994-08-01), Hibbard
patent: 5368618 (1994-11-01), Masmar et al.
patent: 5368619 (1994-11-01), Culler
patent: 5370718 (1994-12-01), Terazawa et al.
patent: 5378251 (1995-01-01), Culler et al.
patent: 5378252 (1995-01-01), Follensbee
patent: 5391210 (1995-02-01), Bilkadi et al.
patent: 5417725 (1995-05-01), Graves
patent: 5421768 (1995-06-01), Fujiwara et al.
patent: 5422316 (1995-06-01), Desai et al.
patent: 5424224 (1995-06-01), Allen et al.
patent: 5435816 (1995-07-01), Spurgeon et al.
patent: 5437754 (1995-08-01), Calhoun
patent: 5441598 (1995-08-01), Yu et al.
patent: 5445996 (1995-08-01), Kodera et al.
patent: 5453312 (1995-09-01), Haas et al.
patent: 5454844 (1995-10-01), Hibbard et al.
patent: 5470368 (1995-11-01), Culler
patent: 5476416 (1995-12-01), Hasegawa et al.
patent: 5489235 (1996-02-01), Gagliardi et al.
patent: 5490808 (1996-02-01), Jantschek et al.
patent: 5500273 (1996-03-01), Holmes et al.
patent: 5525100 (1996-06-01), Kelly et al.
patent: 5527368 (1996-06-01), Supkis et al.
patent: 5607341 (1997-03-01), Leach
patent: 5607346 (1997-03-01), Wilson et al.
patent: 5607488 (1997-03-01), Wiand
patent: 5609517 (1997-03-01), Lofaro
patent: 5624303 (1997-04-01), Robinson
patent: 5643044 (1997-07-01), Lund
patent: 5645682 (1997-07-01), Skrovan
patent: 5645736 (1997-07-01), Allman
patent: 5649855 (1997-07-01), Chikaki
patent: 5782675 (1998-07-01), Southwick
patent: B14773920 (1995-05-01), Chasman et al.
Tomita et al., "A Study for Ultraprecision Processing of Silicon Wafers by Fixed Lapping Stone--A newly developed lapping stone to replace the free abrasive lapping process", J. Precision Engineering, 61, 1428-1432 (1995)-translation included.
Tonshoff et al., "Abrasive Machine of Silicon", Annals of the CIRP, 39, 621-635 (1990).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of modifying an exposed surface of a semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of modifying an exposed surface of a semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of modifying an exposed surface of a semiconductor wafer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-702680

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.