Method of modification and testing flip-chips

Details Method of modification and testing flip-chips Method of modification and testing flip-chips

1997-01-21

1998-11-10

Picardat, Kevin

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

438 14, 438118, H01L 2166

Patent

active

058343237

ABSTRACT:
A method for inspecting and testing IC flip-chips without removing the chips from their packages includes providing at least three alignment holes on a substrate surface of the chip opposite its circuit-patterned face. The alignment indicia are positioned in a predetermined relationship to the circuit pattern, and provide marks for aligning a mirror image of a circuit pattern of the circuit-patterned face as an overlay on the substrate side. The substrate can be thinned in a region corresponding to the circuit pattern to enhance the accessibility of the circuit-patterned side via the substrate.

REFERENCES:
patent: 3984860 (1976-10-01), Logue
patent: 5153507 (1992-10-01), Fong
patent: 5220280 (1993-06-01), Visel et al.
patent: 5262355 (1993-11-01), Nishiguchi et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5444388 (1995-08-01), Ideta et al.

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