Method of minutely roughening substrate surface by etching

Details Method of minutely roughening substrate surface by etching Method of minutely roughening substrate surface by etching

1992-08-28

1993-09-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156663, 156664, 156668, 156904, 427307, 427309, B44C 122, C03C 1500, C23F 100, B29C 3700

Patent

active

052425444

ABSTRACT:
The object of the invention is to minutely roughen a surface of a substrate, e.g. a glass plate, by an etching method for the purpose of enhancing adhesion of a coating film to the substrate surface or preventing sticking of a certain article to the substrate surface. An easily vaporizable material such as a fat or wax as a masking material is used as a masking material, and the substrate surface is scattered with numerous microscopic droplets of the masking material by exposing the substrate surface to vapor of the masking material and simultaneously to vapor of another material, e.g. water or an alcohol, which is immiscible with the masking material and serves the purpose of preventing agglomeration of droplets of the masking material on the substrate surface. After that the substrate is etched with a suitable etching fluid, and then the masking material is removed. As the result the etched surface of the substrate is scattered with numerous microscopic, islet-like land regions.

REFERENCES:
patent: 4465551 (1984-08-01), Horwitz
patent: 4664748 (1987-05-01), Ueno et al.
patent: 5120605 (1992-06-01), Zuel et al.

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