Method of measuring thickness of a multi-layers film

Details Method of measuring thickness of a multi-layers film Method of measuring thickness of a multi-layers film

1996-12-03

1998-07-21

Rosenberger, Richard A.

Optics: measuring and testing

By polarized light examination

Of surface reflection

356362, G01N 2141, G01N 2121

Patent

active

057841675

ABSTRACT:
A multi-layers with (m+1) sublayers is formed on a substrate. The purpose of the present invention is to measure the thickness of the sublayer (m+1) using the ellipsometry even the physical parameters of the other sublayers are unknow. The key of the method is to reguard the multi-layers (sublayer 1/sublayer 2/ . . . /sublayer m) as a reduced layer. Then the multi-layers becomes a double layers formed on a substrate, that is a sublayer (m+1) and a reduced layer. Assume that the sublayer (m+1) is composed of material M. Then the multi-layers becomes a double M layers formed on a substrate, that is a M layer and a reduced layer. A first measurement is performed to measure the thickness (T1) of the double layers by using an ellipsometry. Next, a second measurement is done to measure the thickness (T2) of the reduced layer by using an ellipsometry. The thickness of the sublayer (m+1) can be obtained by performing (T1-T2).

REFERENCES:
patent: 4906844 (1990-03-01), Hall
patent: 5420680 (1995-05-01), Isobe et al.

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