Method of measuring the thickness of the removed layer in subtra

Details Method of measuring the thickness of the removed layer in subtra Method of measuring the thickness of the removed layer in subtra

1983-10-05

1985-04-23

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156646, 156345, 204192E, 204298, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

045128472

ABSTRACT:
A test sample (7) of the same material, or with the same structure as the workpiece (5) exposed to subtractive processing is simultaneously exposed to such processing and consists of a wedge (10) with the angle
.alpha. covered by two covering plates (11) which are complementary to its two surfaces (14). By measuring the distance x.sub.1 between the thus formed gaps (15), and by comparing it with the original distance x.sub.O, thickness z of the respectively removed layer can be determined from the equation ##EQU1##

REFERENCES:
patent: 4367044 (1983-01-01), Booth et al.
IBM Technical Disclosure Bulletin, vol. 24, No. 9, Feb. 1982, Thin Film Monitor for In Situ Measuring of Silicon Etch Rates, J. Greschner et al., pp. 4804-4805.

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