Method of manufacturing wiring board

Details Method of manufacturing wiring board Method of manufacturing wiring board

2007-08-21

2007-08-21

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S832000, C029S847000, C216S017000, C174S360000

Reexamination Certificate

active

11357796

ABSTRACT:
A method of manufacturing a wiring board, including: providing a resin substrate on which is formed a metal layer including a first layer and a second layer formed on the first layer; forming an interconnecting pattern by etching the metal layer so that the interconnecting pattern includes the patterned first layer and second layer and a part of the first layer remains outside the second layer as a residue of the first layer; electroless plating the interconnecting pattern and the residue of the first layer; and then washing the resin substrate. The washing of the resin substrate is performed by using at least one of an acidic solution used for dissolving and removing the residue of the first layer and a metal deposited on the residue of the first layer by the electroless plating and an alkaline solution used for dissolving the resin substrate to remove an area which supports the residue of the first layer.

REFERENCES:
patent: 4963512 (1990-10-01), Iwanaga et al.
patent: 5352325 (1994-10-01), Kato
patent: 5436411 (1995-07-01), Pasch
patent: 5653893 (1997-08-01), Berg
patent: 6228246 (2001-05-01), Datta et al.
patent: 06-342969 (1994-12-01), None

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