4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Akihito Narita

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Method of manufacturing wiring board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Semiconductor module and method of producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2305906

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