Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-03-08
2005-03-08
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S614000, C438S652000, C257S736000
Reexamination Certificate
active
06864166
ABSTRACT:
Aspects of the invention provide microelectronic device assemblies including microelectronic components wire bonded to substrates, and methods of forming such assemblies. In one embodiment of the invention, a microelectronic component includes a plurality of multi-layered bond pads. Each of the multi-layered bond pads includes a bond pad base (which may comprise aluminum), an outer bond layer (which may comprise gold), and an intermediate layer between the bond pad base and the outer bond layer. This microelectronic component may be wire bonded to a substrate, with the outer bond layer and the bonding wire both comprising the same metal (e.g., gold). The bonding wire may be reliably stitch bonded to the outer bond layer of the multi-layered bond pads, facilitating manufacture of low profile microelectronic device assemblies.
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Chye Lim Thiam
Yin Leng Nam
Duong Khanh
Micro)n Technology, Inc.
Perkins Coie LLP
Zarabian Amir
LandOfFree
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