Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor
Reexamination Certificate
2008-04-22
2008-04-22
Rose, Kiesha L. (Department: 4176)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Compound semiconductor
C257S200000
Reexamination Certificate
active
07361521
ABSTRACT:
The present invention relates to a method of manufacturing a vertical GaN-based LED. The method includes forming an insulating pattern on a substrate to define LED regions having a predetermined size; sequentially stacking an n-type GaN-based semiconductor layer, an active layer, and a p-type GaN-based semiconductor layer on the substrate except for the insulating pattern to form a light emitting structure; removing the insulating pattern to divide the light emitting structure into LED sections having a predetermined size; forming p-electrodes on the LED sections, respectively; forming a structure support layer on the p-electrodes; removing the substrate to expose the divided n-type GaN-based semiconductor layer; and forming n-electrodes on the exposed n-type GaN-based semiconductor layer.
REFERENCES:
patent: 2007/0082486 (2007-04-01), Yang et al.
patent: 2005-4110 (2005-02-01), None
patent: 10-2005-0060740 (2005-06-01), None
Choi Seok Beom
Lee Jae Hoon
Oh Jeong Tak
McDermott Will & Emery LLP
Rose Kiesha L.
Samsung Electro-Mechanics Co. Ltd.
Trice Kimberly
LandOfFree
Method of manufacturing vertical GaN-based light emitting diode does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing vertical GaN-based light emitting diode, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing vertical GaN-based light emitting diode will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2796120