Method of manufacturing thin-film electronic device having a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S668000, C257SE21008

Reexamination Certificate

active

07553765

ABSTRACT:
A method of manufacturing a thin-film electronic device comprising providing a dielectric layer on a base, providing a first electrically conductive layer having a first opening and covering at least part of the dielectric layer; and forming a first through-hole extending through the base and communicating with the first opening. A second electrically conductive layer may be provided on the base, and a dielectric layer may be provided so as to cover at least part of this second conductive layer.

REFERENCES:
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patent: 6212057 (2001-04-01), Kohara et al.
patent: 6653574 (2003-11-01), Tsai et al.
patent: 6759257 (2004-07-01), McCormack et al.
patent: 6910266 (2005-06-01), Lee et al.
patent: 2006/0223226 (2006-10-01), Guzek et al.
patent: A 11-260148 (1999-09-01), None
patent: A 2004-048045 (2004-02-01), None

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