Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2008-07-01
2008-07-01
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C257SE21001
Reexamination Certificate
active
11220842
ABSTRACT:
A method of manufacturing a thin film device includes forming a pair of multi-layered structures by bonding a transfer layer including a thin film device to a temporary transfer substrate, respectively adhering the transfer layers of a pair of the multi-layered structures to both surfaces of a transfer-target substrate; and separating the temporary transfer substrate from each of the transfer layers adhered to the transfer-target substrate. The bonding step includes forming the transfer layer on a transfer-source substrate via a first separation layer separated in accordance with application of a predetermined amount of energy, bonding the transfer layer to the temporary transfer substrate, and separating the transfer-source substrate from the transfer layer by applying energy to the first separation layer to cause a boundary separation and/or an intra-layer separation in the first separation layer.
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Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
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