Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2011-01-25
2011-01-25
Stark, Jarrett J (Department: 2823)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
C438S557000, C438S650000, C438S686000, C257SE21351
Reexamination Certificate
active
07875525
ABSTRACT:
A stack-type capacitor includes a lower electrode, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, wherein the lower electrode includes a first metal layer having a cylindrical shape and a second metal layer filled in the first metal layer. In the capacitor, an amount of oxygen included in the lower electrode is decreased to suppress oxidation of a TiN layer. Thus, a stable stack-type capacitor may be formed, which increases greatly the performance of highly integrated DRAMs.
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Baik Hion-Suck
Choi Jae-Young
Kim Soon-ho
Lee Jung-Hyun
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
Stark Jarrett J
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