Electrical connectors – With circuit conductors and safety grounding provision – Grounding to conductive sheath of cable
Reexamination Certificate
2011-02-08
2011-02-08
Monbleau, Davienne (Department: 2893)
Electrical connectors
With circuit conductors and safety grounding provision
Grounding to conductive sheath of cable
C257SE25004, C257SE25007, C136S256000, C136S261000
Reexamination Certificate
active
07883343
ABSTRACT:
A solar cell that is readily manufactured using processing techniques which are less expensive than microelectronic circuit processing. In preferred embodiments, printing techniques are utilized in selectively forming masks for use in etching of silicon oxide and diffusing dopants and in forming metal contacts to diffused regions. In a preferred embodiment, p-doped regions and n-doped regions are alternately formed in a surface of the wafer through use of masking and etching techniques. Metal contacts are made to the p-regions and n-regions by first forming a seed layer stack that comprises a first layer such as aluminum that contacts silicon and functions as an infrared reflector, second layer such titanium tungsten that acts as diffusion barrier, and a third layer functions as a plating base. A thick conductive layer such as copper is then plated over the seed layer, and the seed layer between plated lines is removed. A front surface of the wafer is preferably textured by etching or mechanical abrasion with an IR reflection layer provided over the textured surface. A field layer can be provided in the textured surface with the combined effect being a very low surface recombination velocity.
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Cudzinovic Michael J.
Kaminar Neil
McIntosh Keith
Mulligan William P.
Pass Thomas
Monbleau Davienne
Okamoto & Benedicto LLP
Reames Matthew
Sunpower Corporation
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